报告题目：Design and Design Automation of Flexible Hybrid Electronics for High-Fidelity Wearable Applications

演讲摘要：A key driving force for advancing the Flexible Hybrid Electronics (FHE) technology is the strong need for thinner, cheaper, lightweight, mechanical flexible, and large-area electronics to meet the requirements of wearable electronics, artificial skins, and low-cost internet of things (IoT). However, the low cost and low temperature requirement for fabrication on a flexible substrate, the large-area nature of flexible sensor arrays, the performance variations and long-term degradation due to mechanical bending, stretching and twisting during the use present significant challenges to flexible circuit and system design. In this talk, I will first elaborate the recent technology advances in flexible electronics and its design challenges, and then provide an overview of needed advances in design and design automation to alleviate these challenges encountered in high-fidelity skin electronics and wearable applications.

讲者简介：Prof Tim Kwang Ting Cheng (郑光廷) is the Dean of Engineering at HKUST in concurrence with his appointment as Chair Professor jointly in the Department of Electronic and Computer Engineering and in the Department of Computer Science and Engineering. He graduated from University of California, Berkeley in 1988 with a PhD in Electrical Engineering and Computer Sciences. Before coming to HKUST, he was a Distinguished Professor of Electrical and Computer Engineering (ECE) at the University of California, Santa Barbara, where he served since 1993. Prior to teaching at UC Santa Barbara, he spent five years at AT&T Bell Laboratories. At UC Santa Barbara, Prof Cheng had taken up various important academic leadership roles, such as Founding Director of the Computer Engineering Program from 1999 to 2002, Chair of Department of ECE from 2005 to 2008, and Associate Vice-Chancellor for Research from 2013 to 2016 where he helped oversee the research development, infrastructure, and compliance of UCSB’s research enterprise with over US$200 million extramural research funding. An internationally leading researcher with rich experience in fostering cross-disciplinary research collaboration, Prof Cheng is a world authority in the field of integrated circuit design, design automation, verification and testing, as well as an impactful contributor across a wide range of research areas including computer vision and medical image analysis. He had previously served as Director of the US Department of Defense Multidisciplinary University Research Initiative (MURI) Center for 3D Hybrid Circuits. He has published more than 500 technical papers, co-authored five books, held 12 US patents, supervised more than 60 PhD dissertations, and transferred several of his inventions into successful commercial products.